成型温度对聚苯并咪唑-酰亚胺性能的影响

Effect of Film-forming Temperature on Properties of Polyimide with Benzimidazole Moiety

为了提高聚酰亚胺的性能,合成了含有苯并咪唑结构单元的聚酰亚胺。并考察了成型温度对聚酰亚胺薄膜理化性能、力学性能及摩擦学性能的影响。结果表明,随着成型温度的升高,薄膜的硬度、拉伸强度均随之增加。同时成型温度对材料的摩擦磨损也有明显的影响。结果表明,成型温度为350℃时,薄膜表现出了较低的摩擦因数及优良的抗磨性能。

To improve properties of polyimide,we synthesized a kind of polyimide with benzimidazole moiety in its backbone.Meanwhile,effects of forming temperature on the chemical and physical properties,mechanical and tribological properties were investigated.Results show that the hardness and tensile strength increase with the rising of preparation temperature.And forming temperature also has strong influence on tribological properties of polyimide film,and the film prepared at 350 ℃ presents lower friction coefficient and good wear resistance.