一种射频系统的三维系统级封装设计与实现

Design and Implementation of a 3D System-in-Package for RF System

三维封装已经成为实现电子系统进一步集成化的主要方式.为了满足射频收发系统的小型化需求,通过采用柔性基板进行三维垂直互连,设计并实现了一种射频系统的三维系统级封装,封装尺寸为50mm*52.5mm*8mm,相比于原版,尺寸减小近20倍.同时利用HFSS和SIwave软件对系统进行了信号完整性(SI)和电源完整性(PI)设计,并进行优化.仿真结果表明:关键时钟走线插入损耗低于0.31dB,回波损耗大于22dB,眼图质量良好,并且电源分配网络(PDN)阻抗等均满足系统设计要求.

3D packaging has become the important way for the further integrate of electronic systems. In order to meet the miniaturization requirements of radio frequency system, a 3D System-in-Packaging （SIP） of RF system is designed and implemented by using flexible substrate as three-dimensional vertical interconnectioru The size of the package is 50mm＊ 52.5mm ＊ 8mm, almost reducing the area 20 times compare to the prototype. HFSS and SIwave are used to design and optimize the signal integrity （SI） and power integrity （PI） of the system. The simulation results show that the insertion loss of the critical clock is less than 0. 31dB, the return loss is more than 15 dB, and the eye quality is good. Meanwhile, the Power distribution network （PDN） impedance meets the design requirements.