硅片研磨机的研磨料连续供给系统设计

Design Of Continuous Abrasive Feeding System For Silicon Wafer Grinder

文章介绍了硅片双面研磨机及其工艺,指出单磨料桶供料系统不能连续供给研磨料。设计了双磨料桶供料系统,在硅片双面研磨机上实现了液态研磨料的连续供给。

This article introduces the silicon double-sided grinding machine and its technology, and points out that the singlebarrel feeding system can not supply the abrasive continuously. The double-barrel feeding system was designed, and the continuous supply of liquid abrasive was realized on the silicon wafer double-sided grinding machine.