基于成组技术的厚膜混合集成电路(HIC)基板生产研究

Research on the Production of Thick Film Hybrid Integrated Circuit (HIC) Based on Group Technology

厚膜混合集成电路(HIC)以其小体积、高可靠性和较强的环境适应性等性能指标,广泛应用于航天、航空、兵器、电子等武器装备领域。但是在多品种、小批量、短交期等订单特点的约束下,对于自制件厚膜电路基板的生产也带来了极大的约束,一方面无法采用大批量生产模式组织生产,另一方面生产资源利用率不高导致成本居高不下,因此必须进一步优化、改进生产管理模式。文章针对这种多品种、小批量、短交期厚膜混合集成电路(HIC)订单的特点,基于成组技术原理,提出一种自制件基板生产管理方式。

Thick film hybrid integrated circuit （HTC ） for itssmall volume, high reliability and strong environment adaptability performance indicators, are widely used in aerospace,aviation, weapons, electronic, and other areas of the weaponsand equipment. But in many varieties and small batch, shortdelivery order characteristics under the constraint of thehomemade pieces of thick film substrate production hasbrought tremendous constraints, on the one hand can＇t organize production using mass production mode, on the otherhand, high production cost of resource utilization is not high,so must be further optimized, improving production management mode. Based on the principle of group technology, thispaper puts forward a method of production management ofself-made parts based on the characteristics of the order ofthe multi -variety, small -batch and short -delivery thick filmhybrid integrated circuit HIC .