基片式光纤光栅应变传感器增敏结构研究

Research on the sensitivity structure of the substrate fiber grating strain sensor

改变光纤光栅(FBG)传感器的封装结构在提高传感器的测量灵敏度、保护传感器方面具有重要的作用。在传统应变片封装结构的基础上,设计了一种具有新型增敏结构的基片式封装结构。对新型封装的结构参数与传感器应变灵敏度之间的关系进行了仿真分析,并与一般封装结构的特性进行了对比。仿真结果表明,在整体尺寸相同的情况下,采用新型增敏结构应变片的应变灵敏度为463με/N,是一般封装结构应变片的3.4倍。对FBG传感器进行了封装处理和对比测试实验,实验结果与理论设计相符合。

The encapsulation structure of fiber grating sensor plays an important role in enhancing the measurement sensitivity and protecting the Fiber Bragg Grating（FBG） sensor unit. Based on the traditional strain gauge packaging structure, this paper designs a new kind of sensitizing structure for the FBG encapsulation structure in substrate type. The relationship between the structure parameters of the new packaging structure and the strain sensitivity is simulated and compared with the general packaging structure.The simulation results show that the strain sensitivity of the strain gauge with the new sensitized structure is 463με/N, which is 3.4 times of the gauge with normal encapsulated structure. The encapsulation and contrast test of FBG sensor were carried out, and the experimental result shows that it is in accordance with that of the simulation.