叔胺铜离子络合物的表征及在铜离子缓释防污涂料中的应用

Characterization of Tertiary Amine-Cu Complex and Application in Copper Ion Slow-release Coatings

以五水合硫酸铜和甲基丙烯酸N,N-二甲基氨基乙酯为原料得到络合物,并利用傅里叶红外光谱及核磁共振谱对络合物进行表征.结果表明,铜离子与叔胺基发生配位,测定甲醇溶液中的电导率验证其最大配位数为4.形成的络合物对金属离子的释放具有缓释作用.合成了一系列甲基丙烯酸N,N-二甲基氨基乙酯无规共聚物涂料,结果表明,加入甲基丙烯酸N,N-二甲基氨基乙酯使涂料具有更好的抗菌性能且有助于延长其防污性能.

Controlling the release rate of biocides in antifouling coatings is beneficial to marine environment and economy. One of the promising approaches to achieve the controllable release is to complex the metal ions with polymers. We reported a new type of complex by coordinating copper sulfate（ CuSO4） with N,N-dimethylaminoethyl methacrylate（ DMAEMA）. The complex was characterized by Fourier transform infrared（ FTIR）spectroscopy and nuclear magnetic resonance（ NMR） spectroscopy. The results confirmed that the copper ions coordinate to tertiary amino groups of DMAEMA. A maximum coordination number of four was determined by measuring the conductivity of complex via a designed experiment. Conductivity and antimicrobial results revealed that the formation of complex slows the release rate of copper ions. Coatings with different contents of PDMAEMA were prepared,the antibacterial test and field test indicated that higher content of PDMAEMA in a coating demonstrated better antifouling ability.