不同厚径比通孔直接电镀的可靠性研究

Reliability study on direct electroplating of through hole with different aspect ratio

文章主要研究了在不同的板厚孔径比下印制电路板通孔导电膜直接电镀铜的可靠性。利用扫描电子显微镜(SEM)观察在导电膜上电镀铜的微观形貌,背光测试检测在导电膜上短暂电镀铜的效果,热应力测试检测孔铜的耐热性能,并打切片分析直接电镀所得孔铜厚度及电镀均镀能力(Throwing Power)。

This paper mainly studied the reliability of direct copper plating of through-hole with conductive film on PCB by different aspect ratio. Scanning Electron Microscope（SEM） was used to observe the morphology of copper electroplated on the conductive film. Backlight test was used to test the coverage of short-term electroplating of copper on the conductive film. Thermal stress test was used to measure the thermal resistance of copper in the hole. The thickness of the hole copper and the Throwing Power of the direct plating were measured by cross section