嵌入铜块功放槽电镀铜颗粒改善

Improvement of plating copper nodules in cavity in embedded copper coin PCB

埋铜PCB板需要制作散热槽,其底部在电镀过程中易产生铜颗粒,现设计DOE试验分析其主要影响因素,在相同电镀反应条件下,对比了不同铜材质、不同深度、不同铜块尺寸对铜颗粒的影响,从而找到改善铜颗粒的方法。

Usually the embedded copper coin PCBs have heat-sink cavities in the location of coin. During plating copper nodules often occur on the bottom of the cavities. DOE tests are designed to find out main affecting factors of plating nodules. Under the same plating conditions, this paper compares the different copper materials, cavity depth and copper coin size to find the methods to improve plating nodules.