基于自定义探针的绑定前TSV测试方法

Pre-bond TSV test method using custom pad

提出了一种基于自定义探针的绑定前TSV测试方法,该方法采用兼容于IEEE 1149.1测试标准的可测性设计结构,通过片上测试电路连接穿透硅通孔（TSV）前端和自定义探针连接TSV后端构成闭合回路,使得阻性故障测试不受故障位置影响,测试结果具有更高的精度。此外,与暂态过程中捕获TSV测试结果的其他测试方法不同,本方法是在稳态过程中进行,这使得寄生电容、TSV电容和生产工艺偏差对测试结果的影响更小,测试鲁棒性更高。经过HSPICE的仿真验证,证明了其有效性,根据仿真结果,对其测试精度,测试时间以及芯片占用面积进行了分析与评估。

A novel pre-bond through-silicon via（TSV） test method using customized pad is proposed. By using IEEE1149. 1 compatible design for testability（Df T） structure,the test circuit is connected with TSV front side and the custom pad is connected with TSV end side. As a result,a closed loop is built to implement TSV double-end test,making the test results independent of fault-location.Moreover,different from capturing TSV test results in transient process for conventional methods,the proposed method captures the TSV voltage when it is charged to steady-state,which makes the test results robust against process variation to a certain extent. The effectiveness of the proposed method is proved through HSPICE simulation. And the overall assessment on test resolution,test time,and the Df T area cost are analyzed and evaluated.