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巴基纸/SMP复合材料温度场模拟研究

Simulation analysis on temperature field of buckypaper/SMP composites
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摘要 为了优化设计巴基纸/SMP复合材料中巴基纸埋入方式和尺寸参数,采用有限元软件FLUENT分析了加热过程中巴基纸形状及厚度对巴基纸/SMP复合材料温度场分布的影响规律。分析结果显示,和平板形巴基纸/SMP复合材料相比,相同加热工况条件下,矩形弯曲巴基纸/SMP复合材料虽然在加热过程中达到稳态所需的时间略短,加热速度也较慢,最高温度和平均温度相对更低,但是其温度场分布更加均匀。分析认为,巴基纸的形状和厚度改变时,导致巴基纸的单位体积内热源也发生变化,进而影响了巴基纸/SMP复合材料的温度场分布。巴基纸的单位体积热源越大,其产热量越大,巴基纸/SMP复合材料的最高温度和平均温度越高,其温度分布均匀性越差;并且由于散热速率低于产热量的增大,因此巴基纸/SMP复合材料达到稳态所需时间越长。 For the optimal design of the embedded methods and size parameters of buckypaper in the buckypaper/SMP composites,FLUENT is used to analyze the effect of shape and thickness of buckypaper on the temperature distribution of the buckypaper/SMP composites in the heating process.The analysis show that,compared with composites reinforced by flat buckypaper,the maximum and average temperature of the composites reinforced by pulse bending buckypaper are lower,the heating rate is slowly and the time to reach the steady state is shorter in the heating process under the same working conditions,but the temperature distribution is more even.It is concluded that the shape and thickness of buckypaper can change the unit volume heat of buckypaper,thereby affecting the temperature field distribution of buckypaper/SMP composites.When the unit volume heat of buckypaper is bigger,the heat production is bigger,the maximum and average temperature are higher,and the temperature distribution is more uneven.Because the heat dissipation rate is lower than the increase rate of heat production,it takes longer time for buckypaper/SMP to reach the steady state.
作者 张阿樱 吕海宝 ZHANG Aying;LYU Haibao(Library,Harbin University,Harbin 150086,China;Center for Composite Materials and Structures,Harbin Institute of Technology,Harbin 150001,China)
出处 《功能材料》 EI CAS CSCD 北大核心 2018年第7期7076-7081,共6页 Journal of Functional Materials
基金 黑龙江省自然科学基金资助项目(E201454)
关键词 巴基纸 形状记忆聚合物 复合材料 热传导 模拟 buckypaper shape memory polymer composites thermal conductivity simulation
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  • 1卢金荣,吴大军,陈国华.聚合物基导电复合材料几种导电理论的评述[J].塑料,2004,33(5):43-47. 被引量:47
  • 2倪江锋,周恒辉,陈继涛,张新祥.锂离子电池集流体的研究[J].电池,2005,35(2):128-130. 被引量:25
  • 3李文春,沈烈,孙晋,郑强,章明秋.多壁碳纳米管填充高密度聚乙烯复合材料的导电性和动态流变行为[J].高分子学报,2006,16(2):269-273. 被引量:24
  • 4Sire L C, Ramanan S R, Ismail H, et al.Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes[J]. Thermochimica Acta, 2005,430(1-2) : 155-165.
  • 5Zhou W Y,Qi S H,Tu C C,et al.Effect of the particle size of Al2O3 on the properties of filled heat-conductive silicone rubber[J]. Journal of Applied Polymer Science, 2007, 104(2):1 312-1 318.
  • 6Ishida H, Rimdusit S. Very, high thermal conductivity obtained by boron nitride-filled polybenzoxazine[JJ. Thermochimica Acta, 1998,320 (1-2): 177-186.
  • 7Peng W Y, Huang X Y, Yu J H, et al. Electrical and thermophysical properties of epoxy/aluminum nitride nano-composites : Effects of nanoparticle surface modification[J]. Composites (Part A):Applied Science and Manufacturing, 2010,41 (9) :1 201-1 209.
  • 8Wattanakul K, Manuspiya H, Yanumet N.The adsorption of cationic surfactants on BN surface : Its effects on the thermal conductivity and mechanical properties of BN-epoxy composite[J]. Colloids and Surfaces A :Physieoehemical and Engineering Aspects, 2010,369 ( 1-3 ) : 203-210.
  • 9Suriati G,Mariatti M,Azizan A.Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applieations[J]. Journal of Materials Scienee: Materials in Electronics, 2011,22 ( 1 ) :56-63.
  • 10Yu A P, Ramesh P, hkis M E, et al.Graphite nanoplateletepoxy composite thermal interface materials[J]. Journal of Physical Chemistry ( C ), 2007,111 ( 21 ) : 7 565-7 569.

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