摘要
采用放电等离子烧结技术制备60 vol%SiCp/Al-5Si-2.5Mg复合材料,研究SiC粒径比及粗/细体积比对复合材料微观组织、热导率和抗弯强度的影响。结果表明：随着细SiC粒径减小,其抗弯强度增加、热导率降低;同时,随着细SiC体积分数增加,其抗弯强度增加、热导率先升高后下降;当复合材料中SiC粒径比为76/16、体积比为3∶1时,热导率、平均热膨胀系数（100~400℃）、抗弯强度分别为214 W/（m·K）、9.8×10^-6K^-1和309 MPa,其断裂方式以SiC解理断裂和基体的韧性断裂为主。
SiCp/Al-5 Si-2. 5 Mg composites reinforced with 60 vol% SiC were fabricated by spark plasma sintering. The effect of particle size ratio and volume fraction ratio of SiC on microstructure, thermal conductivity and bending strength of the composites were investigated. The results show that the bending strength of the composites increases and thermal conductivity decreases with the decreasing of SiC particle size,meanwhile,the bending strength increases and thermal conductivity first increases then decreases with the increasing of volume fraction of the fine SiC particle. When the SiC particle size ratio is 76/16 and volume fraction ratio is 3 ∶ 1,the thermal conductivity,average thermal expansion coefficient（ 100-400 ℃） and bending strength of the composites are 214 W/（ m·K）,9. 8 × 10^-6K^-1 and 309 MPa,respectively,and the fracture mechanism of the composites is mainly cleavage fracture of SiC and ductile fracture of the matrix.
作者
王武杰
洪雨
吴玉程
WANG Wu-jie;HONG Yu;WU Yu-cheng(Institute of Industry ＆ Equipment Technology,Hefei University of Technology,Hefei 230009,China;School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China;Laboratory of Non-Ferrous Metals and Processing Engineering of Anhui Province,Hefei 230009,China;National-Local Joint Engineering Research Center of Nonferrous Metals and Processing Technology,Hefei 230009,China)
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2018年第7期7-14,共8页
Transactions of Materials and Heat Treatment
基金
国家国际科技合作专项(2014DFA50860)
