带有软表面的V波段微带阵列天线

V band microstrip array antenna with soft-surface

介绍了一种应用于V波段的微带阵列天线。该天线结合了薄膜工艺精度高和厚膜工艺易操作、花费低的优势;馈电层利用共面波导耦合方式使用薄膜石英微电子工艺加工;辐射层采取传统贴片结构方式采用厚膜印刷电路板（PCB）工艺制造。在天线的辐射层加载一种可以抑制表面波的超材料结构——软表面,来改善天线驻波带宽。为了验证软表面的实际效果,设计和加工了带有软表面和未带软表面的天线阵列。测试结果表明带有软表面结构的阵列天线的阻抗带宽（驻波比≤2）为16.7%,增益不低于10.5dBi;与未加载软表面的天线阵列相比性能有相应的改善。

In this paper,we proposes the microstrip array antenna applied in V band.The antenna has the advantages of film technology which is high precision and thick film processes which is easy operation and low cost,one is that the feed layer is adopted by coplanar waveguide coupling energy to radiation layer using film quartz microelectronic technology,and another is that the radiation layer is using the classical patch structure in the thick film printed circuit board process.Besides,we also use metamaterials—soft surface on the radiant layer to improving the bandwidth and increasing the gain,as depressing surface wave.Experimentally,in order to test the effect of the soft-surface,the antenna arrays with soft-surface and without soft-surface were designed and fabricated.The result show that the antenna arrays with soft-surface exhibits an impedance bandwidth（SWR≤2）of 16.7% and a gain of around 10.5 dBi,and it better than the antenna array that is not loaded on the soft-surface.