HDI高铜厚精细线路制作关键技术研究

印制电路板(Printed Circuit Board)简称PCB是重要的电子部件,是电子元器件的支撑体,是电子元器件电器连接的提供者,并大范围应用于各种各样的电子产品中。随着电子设备越来越复杂,需要的零配件自然越来越密集了,高密度互连(High Density Interconnect,HDI)印制电路板(简称为HDI板)自然产生,并得到迅速发展。目前,如何让铜厚度高、线路密度大、形状又有规则的HDI高铜厚精细线路在生产中制作出来,已经成为PCB行业的一个关键技术难题。为此,文章以HDI高铜厚精细线路制作关键技术改良全加成工艺为主要研究目标。

The printed circuit board （PCB） is an important electronic component, the support of electronic components, and theprovider of electronic components and electrical connections, widely used in a variety of electronic products. With the increasingcomplexity of electronic devices, the number of components needed is becoming more and more intensive. High Density Interconnectprinted circuit boards （HDI boards） are naturally produced and developed rapidly. At present, how to make HDI high copper thickfine circuit with high copper thickness, high line density and regular shape has becomea key technical problem in PCB industry.Therefore, the main research object of this paper is to improve the full addition technology of HDI high copper thick fine circuit.