晶圆清洗技术应用

Wafer cleaning technology and process research

介绍在半导体IC制成中晶圆清洗的重要性,随着集成电路的发展,对硅片的表面的洁净度要求越来越高,对比以往的湿法化学清洗存在的污染物质不易处理的问题,提出利用先进旋转喷淋技术,同时采用气液混合的清洗方式对硅片表面进行清洗,清洗后采用惰性气体直接干燥。旋转喷淋清洗方式避免其他清洗方式的不足,提高了硅片的清洗效率。

The importance of wafer cleaning in semiconductor IC is introduced. The cleanliness of the surface of the silicon chip is more and more demanded with the development of the integrated circuit.The advanced rotary spray technology is proposed by comparing with the problem that pollution is not easy to dispose of previous wet chemical cleaning. At the same time,the surface of the silicon wafer was cleanned by means of a mixture of air and liquid. The inert gas is used to dry directly after cleaning.The rotary spray cleaning method avoids the shortage of other cleaning methods and improves the cleaning efficiency of the silicon chip.