12 W高功率高可靠性915 nm半导体激光器设计与制作

Design and fabrication of 12 W high power and high reliability 915 nm semiconductor lasers

本文设计并制作了一种高效率、高可靠性的915 nm半导体激光器。半导体激光器是光纤激光器的关键部件,为了最大限度地提高器件的电光转换效率,在设计上采用双非对称大光腔波导结构,同时对量子阱结构、波导结构、掺杂以及器件结构进行了系统优化。器件模拟表明,在25℃环境温度下,器件的最高电光转换效率达到67%。采用金属有机气相沉积(MOCVD)法进行材料生长,随后制备了发光区域宽度为95μm、腔长为4.8 mm的激光芯片。测试表明,封装后器件的效率以及其它参数指标达到国际先进水平,在室温下阈值电流为1 A,斜率效率为1.18 W/A,最高电光转换效率达66.5%,输出功率12 W时,电光转换效率达到64.3%,测试结果与器件理论模拟高度吻合。经过约6 000 h的寿命加速测试,器件功率没有出现衰减,表明制作的高功率915 nm激光芯片具有很高的可靠性。

In this paper,a high efficiency and high reliability 915 nm semiconductor laser is designed and fabricated,which is a key component of the fiber lasers. In order to maximize the electro-optic conversion efficiency of the device,a double asymmetric large-cavity waveguide structure is adopted in the design,and the quantum well structure,waveguide structure,doping,and device structure are systematically optimized. Device simulations show that the device＇s maximum electro-optical conversion efficiency reaches 67% at an ambient temperature of 25 ℃. The material is grown by Metal Organic Chemical Vapor Deposition（ MOCVD）,and a laser chip having a light emitting region width of 95 μm and a cavity length of 4. 8 mm is prepared. Tests show that the efficiency of the packaged device and other parameter indices have reached the advanced level of similar devices in the world. In the case that the threshold current is 1 A at room temperature,the slope efficiency is 1. 18 W/A,the maximum electro-optic conversion efficiency is 66. 5%,the output power is 12 W,and the electro-optical conversion efficiency reaches 64. 3%. It can be seen that the test results are in good agreement with that of the device theory simulation. After approximately 6 000 hours of long-life accelerated testing,the device power does not attenuate,indicating that the produced high-power 915 nm laser chip has very high reliability.