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键合机芯片翻转机构及其动力学仿真

Flip-chip Equipment for Bonding and Dynamics Simulation
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摘要 在Fine-Out(扇出)芯片键合制程中需要对芯片(Die)进行重新布局,由于制造工艺的不同,芯片标记面可能存在向上或向下工况。介绍了芯片翻转机构的工作流程和设计开发过程。 In the fine-out chip Bonding process, Bonding machine need redistribution for chip.Becauseof different manufacturing process.there are up or down conditions in the chip.this article analyzes thework process and development process for flip-chip Equipment.
作者 郭耸 朱欢欢 陈飞彪 GUO Song;ZHU Huanhuan;CHEN Feibiao(Shanghai Micro Electronics Equipment Co.,Ltd,Shanghai 201203,China)
机构地区 上海微电子装备有限公司
出处 《电子工业专用设备》 2018年第4期7-9,26,共4页 Equipment for Electronic Products Manufacturing
关键词 扇出片键合 键合机 芯片翻转机构 Fine-out chip bonding Bonding machine Flip-chip equipment
分类号 TN305 [电子电信—物理电子学]
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电子工业专用设备
2018年 第4期

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