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Au/NiCr/Ta多层金属膜择优取向与残余应力的关系 被引量:3

THE RELATIONSHIP BETWEEN PREFERRED ORIENTATION AND STRESS IN MULTI-LAYERED Au/NiCr/Ta FILMS
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摘要 研究了 Au/NiCr/Ta多层金属膜的择优取向、残余应力以及它们之间的关系.结果表明,在实验范围内,残余应力随沉积温度变化不大,沉积态薄膜均表现为残余拉应力,经400℃Ar气中退火60 min转变为压应力.相应出现(111)与(200)衍射峰相对强度比值减小.Au(200)取向增加时,倾向为压应力,择优取向最大时有最低的平均残余压应力;Au(111)择优取向最大时有最高的平均残余拉应力;说明Au膜的择优取向和残余应力状态存在一定的联系. Au/NiCr/Ta multi-layered metal films were deposited onto Al2O3 substrate by magnetron sputtering and then annealed in Ar atmosphere. The crystal orientation, residual stress and their relationship were investigated as a function of deposition temperature. The residual stress in as-deposited films was tensile and changed to compressive after samples annealing at 400 degreesC. It is clarified that the stress in the film plane depends on crystal orientation. The films with (200)-preferred orientation have the lowest compressive stress and those with (111)-orientation have the highest tensile one. It appears that the intensity ratio of diffraction peaks of (111) and (200) can be used as a merit for the state of residual stress and its magnitude in the film.
出处 《金属学报》 SCIE EI CAS CSCD 北大核心 2002年第9期932-935,共4页 Acta Metallurgica Sinica
基金 国家自然科学基金 59931010 科技部中法先进研究计划PRAMX9906资助项目 部分内容受国家教育部骨干教师基金 材料三束改性国家重点实验室访问学者项目资助
关键词 Au/NiCr/Ta多层金属膜 择优取向 残余应力 微波集成电路 Au/NiCr/Ta film preferred orientation residual stress
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