OSP产品在BGA盘露铜的改善方法

The improvement methods for OSP products exposed copper on BGA pad

在OSP生产过程中会出现BGA连接盘不上膜,导致BGA盘氧化造成拒锡问题。为了有效解决与预防此问题,需对设备、物料、现场环境,做管制要求。本文主要对OSP流程的控制及物料的使用,药水成份的控制进行讨论。

In the production process of OSP, there will be no OSP on the BGA pad, resulting in a single point oxidation of BGA caused by tin rejection problems. In order to effectively solve and prevent this problem, regulatory requirements must be placed on the equipment, materials, and on-site environment. This article mainly discusses the control of the OSP process, the use of materials, the control of potion ingredients.