高厚径比电路板化学镀铜气泡型孔无铜的改善

The improvement of copper free air bubble forming holes in Printed Circuit Board with high aspect ratio

文章通过对高厚径比PCB化学镀铜存在孔内无铜原因的研究分析,孔内存在气泡是主要原因之一。降低化学镀铜液表面张力,减少孔内气泡的形成,协同优化镀篮,能够减少化学镀铜气泡造成的孔内无铜。

In this paper, the reason for the existence of copper free copper in the hole of high thickness diameter ratio PCB electroless copper plating is studied and analyzed. One of the main reasons is the existence of bubbles in the hole. Reducing the surface tension of the electroless copper plating solution and reducing the formation of the bubbles in the hole and together with the plating basket improvement can reduce the copper free copper plating bubbles.