基于应变测试技术的手机跌落碰撞下BGA芯片失效分析

Failure Analysis of BGA Chip Based on Strain Test Technology for Mobile Phone Drop Collision

随着智能手机的应用越来越普遍,手机已经成为一个巨大的产业。手机使用过程中经常发生跌落导致手机故障已经成为手机的主要失效模式之一,对手机的返修率和客户体验带来巨大影响。手机跌落导致手机内大量使用的BGA封装的芯片失效是故障的主要原因之一,造成这一故障的机理是手机落地时与地面碰撞带来的冲击力造成手机电路板发生瞬间形变,进而导致BGA封装的焊球掰断,导致芯片失效。本研究通过金像切片、应变测试、真机跌落等三个实验对手机跌落现象进行研究,通过这种方法,工程师可以对跌落造成的电路板应变量进行量化,为改善手机抗跌设计提供参考。

with the application of smart phones becoming more and more common, mobile phones have become a huge industry. Mobile phones often drop during use, leading to mobile phone failure has become one of the main failure modes of mobile phones, which has a huge impact on the repair rate and customer experience of the mobile phone. Mobile phone drop causes the extensive use of the BGA package chip failure is one of the main reason for failure, the failure reason is the impact force of mobile phone when landing brought a collision with the ground caused by the mobile phone circuit board has instant deformation, which leads to the encapsulation of BGA solder ball breaking off, leading to the failure of chip. This study through three experiments： the Microsectioning, strain test, prototype drop on the mobile phone. By this method, the circuit board can be caused by the drop of engineers should be quantifed variables, in order to improve the resilience of mobile phone design to provide the reference.