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甲基基磺酸-双氧水体系对印刷电电路板拆解技术

Study on Dismantling of Waste Printed Circuit Board under CH_4O_3S-H_2O_2 System
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摘要 废印刷电路板上元器件的拆解技术是电路板资源化再利用的重要环节。通过研究甲基磺酸-双氧水体系下元器件的脱落率,得出优化的实验条件为:甲基磺酸浓度范围为3.0~3.5 mol/L,双氧水浓度范围为0.4~0.6 mol/L,反应时间45 min。在该实验条件下,实验样品中焊接元器件脱落率达到100%,实现了电路板基板与元器件的快速高效分离,为废旧电路板上元器件的拆解技术提供一定的技术支撑。 The dismantling technology of waste printed circuit board is an important part of the circuit board treatment. Through the study of removal rate of components under CH4 O3 S-H2 O2 system, the optimum experimental conditions were as follows: the concentration of methyl sulfonate was 3.0-3.5 mol/L, the concentration of hydrogen peroxide was 0.4-0.6 mol/L, and the reaction time was 45 min. Under the experimental conditions, the removal rate of components reached 100% and realized the rapid separation of the circuit board components, which provides technical support for the industrial disassembly of the waste printed circuit boards.
作者 张晓娇 郭耀广 张承龙 关杰 ZHANG Xiaojiao;GUO Yaoguang;ZHANG Chenglong;GUAN Jie(WEEE Research Center;Shanghai Collaborative Innovation Center for WEEE Recycling;School of Environmental and Materials Engineering;Research Center of Resource Recycling Science and Engineering,Shanghai Polytechnic University,Shanghai 201209,China)
出处 《上海第二工业大学学报》 2018年第2期94-97,共4页 Journal of Shanghai Polytechnic University
基金 上海第二工业大学校基金项目(EGD17XQD09) 上海第二工业大学飞跃计划(EGD18XQD24) 上海第二工业大学重点培育学科(XXKPY1601) 上海第二工业大学重点学科建设项目(XXKZD1602) 上海市高原学科-环境科学与工程(资源循环科学与工程)(A30DB182602)资助
关键词 电子废弃物 印刷电路板 拆解 脱落率 甲基磺酸 electronic waste printed circuit board dismantling removal rate methyl sulfonic acid
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