摘要
在(111)硅片上研制了一种单硅片单面硅微机械加工的热温差式流量传感器。利用Comsol仿真软件对敏感结构参数进行优化设计,最大程度降低了传感器的热损耗,提高了传感器灵敏度和响应时间。此外,得益于MEMS微创手术MIS(Micro-openings Inter-etch&Sealing)工艺技术使得加工后的芯片尺寸仅为0.7 mm×0.7 mm,测试结果表明:传感器灵敏度为107.88m V/(m/s)W(无放大处理),检测响应时间仅为1.53 ms,综合精度为±4%。
A novel thermal flow sensor is proposed and developed,which is fabricated only from the front side of( 111) silicon wafer through bulk-micromachining process. COMSOL Multiphysics software is employed to optimize some sensitive parameters,which gives a promise to isolating the generating heat from the silicon wafer totally and reduces the device thermal loss at utmost. Furthermore,being benefit from the MEMS Micro-openings Inter-etchSealing( MIS) process,the fabricated sensor chip size is as small as 0.7 mm×0.7 mm. The testing results show that the flow sensor achieves an ultrahigh normalized sensitivity of 107.88 m V/( m/s)/W with respect to heating power and gain for nitrogen gas flow. Furthermore,the response time of the sensor is 1.53 ms and the accuracy is ±4%.
出处
《传感技术学报》
CAS
CSCD
北大核心
2018年第6期822-825,共4页
Chinese Journal of Sensors and Actuators
基金
国家自然科学基金面上项目(61674160)