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湿法腐蚀金属铝中胶黏附性技术研究

The Investigation to Improve Photo Resistor Adhesion on the Metal Aluminum Surface
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摘要 湿法腐蚀相对于干法腐蚀操作简单,成本低廉,用时短,产能高等优点在集成电路制造中获得广泛应用。基于湿法腐蚀存在侧向钻蚀的特性,因此对光刻胶和待腐蚀材料黏附性有一定要求。对于金属湿法腐蚀,光刻胶与金属等之间粘附性牢固程度直接影响到湿法腐蚀金属线条的质量,决定金属线条的形貌。如果湿法腐蚀时发生浮胶,光刻胶和待刻蚀物质侧向钻蚀出现不可控现象,金属线条整体或者局部区域变细,会严重影响到产品使用可靠性。通过实验分析金属铝湿法腐蚀烘箱工艺,确定最佳烘箱工艺条件,提高胶的黏附性,并为建立烘箱温度监控提供指导。 The wet etch show more advantage on the simple operation, low cost and short process time with more capacity than that of dry etch. The wet etch has been widely used in the manufacture process. But it is more sensitive on the photo resister adhesion due to the isotropic etch characteristic. For the wet etch on the Aluminum, the adhesion between the photo resister and the metal surface define the profile and width of the metal line. If there is photo resistor lifting during the wet etch process, the metal line will be thinner or broken partly, then show high risk on the reliability. The paper focus on the investigation of the oven process of metal wet etch, set up the best process condition to improve the photo resistor adhesion and share the indication on the oven process monitor.
作者 任萍萍 REN Pingping(Advanced Semiconductor Manufacturing Corporation,Shanghai 200233,China)
出处 《集成电路应用》 2018年第7期33-36,共4页 Application of IC
基金 上海市科学技术委员会科技创新行动计划高新技术基金(17DZ1100300)
关键词 集成电路制造 湿法腐蚀 光刻胶 黏附性 烘箱 IC manufacturing wet etch aluminum photo resistor adhesion oven
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