期刊文献+

平流层电动机控制器热特性仿真分析和实验 被引量:2

Simulation analysis and test on thermal performances of stratospheric motor controller
原文传递
导出
摘要 为得到某电动机控制器在平流层低温低气压环境下工作时的热特性,开展了基于软件Icepak的热仿真分析,并通过地面环境模拟实验和平流层飞行实验对仿真模型进行了验证,仿真结果与实验结果基本吻合。结果表明:控制器的热设计可以满足保温和散热要求;在平流层低气压条件下,内部风扇可有效地保持控制器内部温度的均衡;平流层高度的太阳辐射对控制器内部温度分布有较大影响,在进行热设计时应予以考虑。研究结果为平流层电动机控制器的工程应用提供重要的参考依据。 To obtain the thermal performances of a motor controller working in stratosphere,numerical simulation based on software Icepak was performed.To confirm the accuracy of the numerical model,aground environmental simulation test and a stratospheric flight test were carried out.Results showed that the numerical model equation can simulate the thermal performance of the controller well.The influences of the cooling method of forced convection using an inner fan on the thermal performances were researched.The numerical simulation and flight test results showed that the thermal design of the controller was acceptable in view of stable working.Surface solar radiation should be taken into account,as it will influence the internal temperature.The research results provide important references for the engineering application of the stratospheric motor controller.
作者 聂营 才晶晶 崔燕香 王旭巍 王生 NIE Ying;CAI Jingjing;CUI Yanxiang;WANG Xuwei;WANG Sheng(Academy of Opto-Electronics,Chinese Academy of Sciences,2.College of Materials Science and Beijing 100094,China;Opto-electronic Engineering,University of Chinese Academy of Sciences,Beijing 100094,Chin)
出处 《航空动力学报》 EI CAS CSCD 北大核心 2018年第7期1758-1766,共9页 Journal of Aerospace Power
基金 高分辨率对地观测重大专项目(Y14202A16N)
关键词 平流层电动机控制器 Icepak软件 热仿真分析 环境模拟实验 平流层飞行实验 太阳辐射 stratospheric motor controller Icepak software thermal simulation analysis environmental simulation test stratospheric flight test solar radiation
  • 相关文献

参考文献6

二级参考文献19

  • 1季馨.背靠隔振系统和背靠隔振器弹性特性设计[J].现代雷达,1994,16(4):99-103. 被引量:4
  • 2季馨,周自兴.舰船电子装备隔振系统和背架隔振器研究[J].船舶工程,1996(2):47-50. 被引量:5
  • 3季馨 龚自泽.隔振系统模块设计浅议[J].电子机械工程,1996,2.
  • 4.Flotherm introduction[EB/CD].上海:Flomerics Inc中国代表处,2001..
  • 5.Advanced Thermal Modeling[EB/CD].北京:海基科技发展有限责任公司,2001..
  • 6Enrico D, Giuseppe V. Thermal characterization of compact electronic systems: a portable PC as a study case[ DB/OL]. IEEE, 2002.
  • 7Clemens J M. The conceivable accuracy of experimental and numerical thermal analyses of electronic systems[ DB/OL]. IEEE, 2001.
  • 8Yogendra J, Baelmans M, Copeland D, et al. Challenges in thermal modeling of electronics at the system level : summary of panel held at thermionic 2000[ DB/OL]. IEEE, 2001.
  • 9Ram V, Ihab A Ali. Thermal modeling of high performance packages in portable computers[ DB/OL]. IEEE, 1997.
  • 10余建祖.电子设备热设计及分析技术[M].北京航空航天大学,2000..

共引文献133

同被引文献14

引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部