三维电磁仿真在25 Gbps串行收发通道设计中的应用方法

Using 3D-EM simulator to help design 25 Gbps SERDES channel

高速串行收发信道设计问题在5G通信以及数据中心的设计中越来越受到重视。通过25 Gbps串行多通道收发器PCB设计工程实例,从而分析工程实现过程中遇到的过孔设计、阻抗匹配以及通道串扰等信号完整性问题,采用Cadence Sigrity全波三维电磁仿真的方法和链路仿真方法,有针对性地在工程实现的不同阶段为问题的解决提供不同的策略方法,提升了设计与仿真优化的效率,缩短了从设计到量产的时间。

Design of high speed serializer/deserializer（ SERDES） channel is becoming more and more important in 5 G commutation and data center. In this paper, an engineering example SERDES channel is used to illustrate the strategy and method to help solve the issues in different stage of design process. By Cadence Sigrity 3 D EM simulator and link simulator, via structure design and op-timization, impedance matching and crosstalk issues are well handled. Consequently, it improves efficiency of design and optimiza-tion and shortens the period from design to production.