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国产碳纤维增强树脂基复合材料的界面结合性能研究 被引量:11

Study on interfacial bonding strength of China-made carbon fiber reinforced resin matrix composites
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摘要 研究了国产高强中模碳纤维T800、高模碳纤维M50J及M55J的力学性能及其增强树脂基复合材料的界面结合强度(ILSS),并与日本东丽公司同级别碳纤维进行对比。结果表明:国产M55J碳纤维的拉伸模量为568 GPa,拉伸强度为4.50 GPa,日本东丽公司M55J的拉伸模量为561 GPa,拉伸强度为4.10 GPa,国产高模碳纤维表面石墨化程度高于日本东丽碳纤维,表面呈现更高惰性,其增强树脂基复合材料的ILSS略低于日本东丽碳纤维复合材料;将高强中模碳纤维与高模碳纤维混合后对树脂基体进行增强,混合碳纤维中随着高强中模碳纤维含量提高,其复合材料的ILSS提高幅度也随之增加。 The mechanical properties of China-made high-strength medium-modulus carbon fiber T800, high-modulus carbon fiber M50J and M55J were studied, as was the interfacial bonding strength (ILSS) of the carbon fibers reilfforeed resin matrix com- posite. And the carbon fibers were eonlpared with those of the sanle grade made by Japan Toray Co.. The results showed that the China-made carbon fiber M55J exhibited the tensile modulus of 568 GPa and the tensile strength of 4.50 GPa when the Toray car- bon fiber M55J had the tensile modulus of 561 GPa and the tensile strength of 4.10 GPa; the China-made high-modulus carbon fiber possessed the surface graphitization degree and inertness higher than Toray carbon fiber, and the reinforced resin matrix composite had ILSS slightly lower than that reitfforeed by Toray carbon fiber; and the ILSS of the reinforced composite was in- creased with the content of high-strength medium-modulus carbon fiber when the resin matrix was reinforced with the mixture of high-strength medium-modulus carbon fiber and high-modulus carbon fiber.
作者 支建海 钱鑫 张永刚 王雪飞 陈礼群 李德宏 宋书林 Zhi Jianhai;Qian Xin;Zhang Yonggang;Wang Xuefei;Chen Liqun;Li Dehong;Song Shulin(National Engineering Laboratory of Carbon Fiber Preparation Technology,Ningbo Institute of Material Technology and Engineering,Chinese Academy of Sciences,Ningbo 315201;University of Chinese Academy of Sciences,Beijing 100039)
出处 《合成纤维工业》 CAS 2018年第4期14-17,共4页 China Synthetic Fiber Industry
基金 装备发展部领域基金重点项目(6140922010103) 中科院创新基金(CXJJ-17-M160) 中科院先导专项(Y80707WX02)
关键词 碳纤维 高模量 高强中模 界面结合强度 复合材料 carbon fiber high modulus high-strength medium-modulus inteffacial bonding strength composite
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