摘要
介绍金刚线特点和市场状况,从光伏发电量、硅片切割需求量、单晶硅和多晶硅切割时金刚线的占有率,预测2018年金刚线总体需求。对金刚线母线的原料、工艺流程、生产设备和主要工艺进行研究,说明电镀金刚线时的主要影响因素及控制要点,提出行业发展应关注的几个问题。
To introduce the characteristic and market condition of the diamond wire. The total demand for diamond wire in2018 is predicted from the PV generation,silicon chip cutting demand,and the share of diamond lines in monocrystalline silicon and polysilicon cutting. The raw material,process flow,production equipment and main process of the master wire are studied. The main influencing factors and control points of the electroplating diamond wire are explained,and the problems that should be paid attention to in the development of the industry are put forward.
作者
王宝玉
宋为
张太超
Wang Baoyu;Song Wei;Zhang Taichao(Sinosteel Zhengzhou Research Institute of Steel Wire Products Co.,Ltd.,Zhengzhou 450001,China;Zhongyuan University of Technology,Zhengzhou 450007,China)
出处
《金属制品》
2018年第3期10-13,共4页
Metal Products
关键词
硅片
母线
电镀金刚线
金刚石微粉
silicon slice
master wire
electroplating diamond wire
diamond micropowder