包装材料用陶瓷表面化学沉积Ni-P镀层研究

Study on the Ni-P coatings deposited on the ceramic surface of packaging materials by using electroless plating method

为提高包装材料的表面质量,满足工业生产、航空、航天、日常生活等需求。采用化学沉积方法在包装材料用陶瓷表面沉积Ni-P镀层,利用扫描电镜、X射线衍射仪、DSC差热分析仪和摩擦磨损试验机研究Ni-P镀层的表面形貌、物相结构、晶化温度及耐磨性能。结果表明,当镀液中硫酸镍含量30g/L、热处理温度500℃时,Ni-P镀层的磨损质量达到最小22.2mg。当热处理温度达到500℃时,Ni-P镀层磨损机制主要表现为磨粒磨损和黏着磨损。DSC分析可知,Ni-P镀层主放热峰对应的晶化温度为339℃。当热处理温度达到500℃时,Ni-P镀层最终稳定相为Ni+Ni_3P+NiO。

In order to improve the surface quality of packaging materials,and the requirements for the industrial production,aerospace,daily life are satisfied.Ni-P coatings were deposited on the ceramic surface of packaging materials by using electroless plating method in this paper.The surface topography,phase structure,crystallization temperature,and wear-resisting property of the coatings were investigated by using scanning electron microscope,X ray diffract-meter,differential thermal analyzer,friction wear testing machine.The results indicate that when the nickel sulfate content in the bath is 30 g/L and the heat treatment temperature is 500 ℃,the wear loss weight of the Ni-P coating reaches the minimum of 22.2 mg.The wear mechanism of Ni-P coatings were mainly abrasive wear and adhesive wear with the temperature at 500℃.DSC analysis shows that the crystallization temperature corresponding to the main exothermic peak of the Ni-P coating is 339 ℃.When the heat treatment temperature reaches 500 ℃,the final stable phases of Ni-P coating are Ni＋Ni3P＋NiO.