64×64 InGaAs/InP三维成像激光焦平面探测器

64×64 InGaAs/InP 3D imaging laser focal plane detector

针对900~1 700 nm波长无扫描激光三维成像雷达的需求,研制了一种规模为64×64的线性模式雪崩焦平面阵列(LM-APD-FPA),它由InGaAs/InP雪崩光电二极管阵列与CMOS专用读出电路(ASIC)组成。该器件采用飞行时间(TOF)测距的方式工作,APD光敏芯片将脉冲激光信号转化成脉冲光电流,读出电路对其进行放大、阈值比较后实现激光探测并在每个单元获取光脉冲的飞行时间,将其转化成二进制编码信号后串行输出。测试结果表明,64×64 LM-APD-FPA有效像元最小可探测光功率值约为400 nW,时间分辨率为1 ns。用该探测器在激光雷达系统上实现了无扫描单脉冲激光三维成像,表明了线性模式激光焦平面探测器可用于激光三维成像领域。

For the requirement of non-scanning 3D imaging lidar using the wavelength from 900-1 700 nm, a 64×64 linear-mode avalanche photodiode focal plane array（LM-APD-FPA） was proposed, which was composed of InGaAs/InP avalanche photodiode array and CMOS read-out circuitry（ASIC）. The working mode of this device was time-of-flight（TOF）. APD converted the laser pulse into pulse current which was amplified and thresholded by read-out circuitry, then the laser detection was realized after the comparison of the threshold value, the laser pulse flight time of every pixel was obtained and being converted to binary codes for serial output. Testing results show that the minimal detectable power of 64×64 LM-APD-FPA is 400 nW, time resolution is 1 ns. This device is used in lidar system and realizes non-scanning single-pulse laser 3D imaging, indicating that the linear-mode laser focal plane array is useful in the field of laser 3D imaging.