陶瓷表面激光无钯活化及其化学镀镍

Palladium free activation and electroless nickel plating on ceramic surface

为了实现陶瓷基体表面无钯化学镀镍,以10g/L NiSO_4·6H_2O和45g/L NaH_2PO_2的混合溶液为活化液涂覆于基体表面,利用激光扫描后使基体活化,再进行化学镀镍。研究了激光功率、光斑直径以及扫描速率对镀层覆盖率的影响,通过扫描电镜观察了粗化、活化以及施镀后的微观形貌,并对活化及施镀后的基体表面进行了成分分析,对镀层结合性、导电性以及可焊性进行了检测。结果表明,当以激光功率为3W、光斑直径为2mm、扫描速率为5mm/s对基体进行扫描时,基体表面生成一层平均直径为0.1μm的Ni微粒;施镀后,镀层覆盖率为100%;镀层微观表面平滑、致密,晶胞直径均在10μm以上;镀层中P的质量分数为0.0771,为非晶态结构,具有良好的耐磨性和耐腐蚀性能;镀层具有较强的结合性和良好的可焊性,电阻率为7.67×10^(-5)Ω·cm,为良导体。该工艺成本低、无污染,能实现陶瓷基体表面局部化学镀镍,通过对激光的运动控制,能够使基体表面沉积各种精细图形,具有一定的实用价值。

In order to realize palladium free electroless nickel plating on the surface of the ceramic matrix , the mixedsolution of 10g/L NiSO4 · 6H2Oand 45g/L NaH2PO2 was used as activation solution and was coated on the surface of the matrix. The substrate was activated by laser scanning , and then electroless nickel was carried out. The effect of laser power , spotdiameter and scanning rate on coating coverage was studied. The microstructure of coarsening,activation and plating was observed by a scanning electron microscope. The composition analysis of the substrate surface after activation and plating was analyzed. The adhesion , electrical conductivity and solderability of the coating were detected. The results power is 3W,the diameter of the spot is 2mm and scanning rate is 5mm/s,a layer of Ni particles with an average diameter of0. 1μm is generated on the substrate surface. The coating coverage is 100%. Micro surface of the coating and the diameter of the cell is above 10μm. Mass fraction of P in plating layer is 0. 0771 , with good wear resistance and corrosion resistance for the amorphous structure. The coating has strong adhesion and good weldability. It is good conductor with the resistivity of 7. 67×10^-5Ω· cm. With low cost and pollution-free , the process can realize local electroless nickel plating on thesurface of ceramic matrix. By controlling the motion of laser , all kinds of fine graphics can be deposited on the surface of thematrix. The process has a certain practical value.