导电膏互连电镀通孔的仿真研究

Simulation of the Interconnection Between Conductive Paste and Plating Through Holes

基于导电膏填塞微孔的方法,设计了2种印制电路板导电膏互连层间电镀通孔的结构,并对其进行信号完整性仿真。考察了层间粘结半固片所填塞导电膏的预固化条件对层间导通与半固化片层粘结效果的影响。应用网络分析仪测试塞孔互连结构的信号完整性,并与仿真结果进行对比。采用回流焊测试的方法评定印制电路板塞孔互连结构的可靠性。实验结果表明直线型塞孔互连结构具有最好的信号完整性,能较好地实现电信号的可靠传输。

Based on the micro-through filled with conductive paste,two structures of filling interconnec-tion between conductive paste and plating through holes for printed circuit board were designed to simu-late their signal integrity. Pre-curing conditions of prepreg with filling conductive paste were investigated to find the effects on the layer interconnection and bonding strength. Signal integrity for structures of fill-ing interconnection was tested by a network analyzer,compared with the case for above simulation. The reliability of structures of filling interconnection for printed circuit board was investigated using the re-flow soldering test. The results showed that linear-type filling interconnection had good agreement with signal integrity for reliable transmission of electrical signal.