T型金属化安全膜电容器温度场仿真

Temperature Field Simulation of T Pattern Metallized Safety Film Capacitor

T型金属化安全膜电容器除具备普通自愈式电容器的自愈性外,其膜块化电极提供的第二次保护作用阻止了电容器自愈失败的进一步发展,而极板结构改变引起的温度变化极大地影响了电容器的运行性能及寿命。本文在介绍内部热量产生及散失的基础上,利用ANSYS Workbench15.0对T型金属化安全膜电容器进行温度场仿真,探究膜块宽度与熔丝宽度比、环境温度对电容器最高温度的影响,推导出各影响因素与最高温度的对应关系,为关键尺寸的设计提供校验方法。

T pattern metallized safety film capacitor not only has self-healing performance of general selfhealing capacitor,the secondary protection action provided by its modular electrode prevents further development of self-healing failure,and the temperature variation caused by structure change in electrode greatly affects the operation performance and lifetime of capacitor.In this paper,on the basis of introducing the internal heat generation and dissipation,the temperature field of T pattern metallized safety film capacitor with ANSYS Workbench 15.0 is simulated so to explore the ratio of fuse width and segment width,influence of ambient temperature on the highest temperature of the capacitor,deduce the corresponding relationship between various influence factors and the highest temperature and provide calibration method for the key dimension designation of T pattern metalized safety film capacitor.