熔融石英玻璃无水环境固结磨粒抛光特性

Characteristic of bounded abrasive polishing for fused silica glass in anhydrous environment

为了克服游离磨粒抛光的随机性、磨料浪费以及产生的水合层等问题,提出了一种无水环境下熔融石英玻璃固结磨粒抛光技术。研究实现了稳定的抛光轮烧结工艺,并应用于熔融石英玻璃抛光加工,通过对加工产物和抛光轮粉末进行EDS能谱分析和XRD衍射分析,从微观上初步阐述了固结磨粒抛光的去除机理;从宏观上探索压力和转速对去除效率和表面粗糙度的影响。实验结果表明:加工过程中,在法向力和剪切力作用下,CeO_2磨粒和熔融石英发生化学反应,CeO_2将SiO_2带出玻璃,实现材料去除;同时,压力和转速对加工效率影响并不遵循Preston公式,温升和排屑成为决定去除效率的关键。

In order to overcome the randomness,abrasive waste and hydration layer of free abrasive polishing,a technology of bounded abrasive polishing for fused silica glass under anhydrous environment is proposed.A stable polishing wheel sintering process has been developed and applied to the polishing of fused silica glass.EDS energy spectrum analysis and XRD analysis of the processed products and the polishing wheel powder are carried out.The removal mechanism of consolidation abrasive polishing is preliminarily elaborated,and the effect of pressure and speed on the removal efficiency and surface roughness is explored from the macroscopic point of view.The experimental results show that：in the process,under normal force and shear force,the CeO2 abrasive reacts with the fused silica,CeO2 will bring SiO2 out of the glass,thus to achieve material removal;at the same time,influence of pressure and rotating speed on the processing efficiency does not follow the Preston formula,temperature rise and chip removal of the polishing wheel are the key factors determining the efficiency of removal.