基于HFSS的内存芯片BGA焊点串扰仿真分析

Analysis of crosstalk of the BGA Solder Joint on Memory chip based on HFSS

建立了内存芯片球栅阵列(ball grid array,BGA)焊点串扰HFSS(high frequency simulator structure)电磁仿真模型,基于该模型对两个BGA焊点在高频条件下的串扰问题进行了分析,得到了其近端串扰和远端串扰仿真结果,以及信号频率、BGA焊点最大径向尺寸及BGA焊点高度对串扰强度的影响.利用正交试验设计方法,对16组不同参数水平组合的两个BGA焊点远端串扰进行方差分析.结果表明,近端串扰和远端串扰随信号频率增大、焊点最大径向尺寸增大及焊点高度增大而增大;在置信度为90%情况下,焊点最大径向尺寸对BGA焊点远端串扰有显著的影响,而焊点高度、信号频率对远端串扰影响不显著.

The HFSS crosstalk simulation analysis model of BGA( Ball Grid Array) solder joints on memory chip was developed. The near and far crosstalk simulation results were obtained by analyzing crosstalk of two BGA solder joints under the high-frequency condition based on the model. The impacts of signal frequency,solder joint maximum radial size and solder joint height on crosstalk were also studied. By using orthogonal experiment design method,the far end crosstalk analysis of BGA solder joints which had 16 different process parameters levels combi-nations was performed. Studying results showed that the far end crosstalk increased as the signal frequency,the maximum radial size of the solder joint and the height of solder joint increased.When confidence was 90%,maximum radial size of solder joint had significant effect on the far end crosstalk of BGA solder joints,the solder joint height and the signal frequency size had less effect on the far end crosstalk of BGA solder joints.