钎焊微粉金刚石磨盘磨块排布研究

Study on the grinding blocks arrangement of the brazing micro powder diamond disc

研磨过程中磨块的排布对加工表面的质量起着不可忽视的作用。不同的磨块排布会对加工表面产生不同的加工效果。因此该研究拟通过采用仿真分析的方式对"对称排布"与"螺旋排布"(两种常用的钎焊微粉金刚石磨盘排布形式)在定偏心磨削过程中工件材料的去除均匀性进行分析。仿真结果显示,"对称排布"的去除均匀性要优于"螺旋排布"。相关的硅片与氧化铝陶瓷研磨实验也随之进行。实验结果显示,在相同的加工条件下采用"对称排布"的磨盘进行研磨后的硅片与氧化铝陶瓷片的表面粗糙度与表面轮廓度更好,与仿真结果相一致。

The grinding block arrangement has considerable effects on grinding surface quality.Different grinding block arrangements have special processing effects on the processed surface.Therefore,applying with the symmetrical arrangement and helical arrangement（two common forms of brazing micro-powder diamond block arrangement）,the study focused on analyzing the uniformity of removal of workpiece material in eccentric grinding process with the method of simulation.The simulation results show that the material removal uniformity of symmetrical arrangement is better than that of spiral arrangement.The related silicon and alumina ceramic grinding experiments were also conducted.On the same procession condition,it turns out that the surface roughness and surface profile of silicon and alumina ceramic wafers ground in symmetrical arrangement form is better,which is consistent with the simulation results.