基于静电激振法测量微机械材料的杨氏模量

Young Modulus Measurement of Micromechanical Materials Based on Electrostatic Excitation Method

通过对现阶段制造行业的发展现状进行分析时可以看出,蚀刻硅技术已经能够在实践中得到广泛应用,并且在其本身的作用下制造出来的微机械构件具有非常良好的质量和效果。但是由于其本身在制作过程中具有一定的特殊性和复杂性,所以需要对材料本身的机械性能进行深入研究,比如对其本身的杨氏模量等性能进行测量分析后,才能达到更优化的性能。因此本文利用静电激振法对微机械材料的杨氏模量进行测量,为其本身的性能应用提供有效的依据支持。

Development situation analysis of current manufacturing industry shows,etching silicon technology has been widely applied in practice currently,and micro mechanical components manufactured by itself have goog quality and effect. But it has some particularity and complexity during production process,it is necessary to carry on further research on mechanical properties of materials,such as performance measurement and analysis of Young modulus,to achieve better performance. The artilce discusses measurement of Young modulus of micro mechanical materials by electrostatic excitation method,to provide effective basis support for the performance and application.