宇航用进口低等级芯片制样评价结果判定研究

Research on the Judgment of the Sample Preparation Evaluation Results of Imported Low-grade Chips for Aerospace

为了保证航天器的可靠性,需要对宇航MCM和SIP电路内部选用的低等级芯片的可靠性进行评价。由于受到芯片制样工艺、匹配电路和测试精度等因素的影响,芯片评价中芯片制样评价的结果判定较为复杂。根据宇航用低等级芯片评价的工程实践,梳理出芯片制样评价中电性能指标超差的常见原因,并结合典型的案例分析,归纳总结了芯片制样评价结果判定时应考虑的因素。

In order to ensure the reliability of the spacecraft, it is necessary to evaluate the reliability of low-grade chips used in the MCM and SIP circuits for aerospace. Due to the influence of the preparation process of chips, matching circuit and test accuracy, the result judgment of chip preparation evaluation in chip evaluation is more complex. According to the engineering practice of the evaluation of low-grade chips for aerospace, the common causes of the poor performance of electrical performance index in the chip preparation evaluation are sorted out, and the factors that should be taken into account during the result judgment of chip preparation evaluation are summarized with typical case analysis.