故障根本原因分析在TSQ诊断中的应用

Application of the Root Cause Analysis of Failure in Diagnosis of TSQ

故障根本原因分析是TSQ的关键工具模块,其对于提高产品的可靠性至关重要,因此,在TSQ诊断中,其被广泛地应用于产品可靠性的提高。故障根本原因分析的基本流程为:首先,通过TSQ对企业的设计和管理平台进行诊断,定位关键故障;然后,利用先进的仪器设备、特定的实验和数据分析,查找到故障根本原因;最后,提出针对性的控制和改进措施。介绍了故障根本原因分析在某企业产品DC/DC芯片失效分析中进行关键问题查找、故障定位和改进的过程与效果。

Root cause analysis of failure is a key tool module of TSQ, and it is great significance for the improvement of the reliability of products. Therefore, in TSQ diagnosis, root cause analysis of failure is widely used to improve the reliability of products. The basic process of root cause analysis of failure is as follows： firstly, the design and management platform of enterprises is diagnosed by TSQ to locate the key fault; then, the root cause of the failure is found by using advanced instruments and equipments, specific experiments and data analysis; finally, the targeted control and improvement measures are put forward. The process and effect of the key problem finding, failure location and improvement in failure analysis of an enterprise＇s DC/DC chip based on root cause analysis of failure is introduced.