环境湿气对BGA可靠性影响案例分析

Case Analysis on the Influence of Ambient Humidity on BGA Reliability

作为PCBA中最重要的封装元件之一,BGA器件对于保障PCBA的质量与可靠性具有重要的作用。因此,分析BGA器件的失效现象并制定相应的解决措施具有重要的意义。利用X-Ray检测、染色渗透检测、金相切片分析和声学扫描分析等方法对BGA器件的功能失效现象进行了详细的分析,找到了器件失效的原因,对于避免类似失效现象再次发生,保证器件的可靠性具有一定的意义。

As one of the most important packaging components in PCBA, BGA devices play an important roly in ensuring the quality and reliability of PCBA. Therefore, it is of great significance to analyze the failure phenomenon of BGA and formulate corresponding solutions. The functional failure phenomenon of BGA devices is analyzed in detail by means of X-ray detection, dye penetration, metallographic section analysis and accoustic scanning analysis, and the causes of device failure are found out, which is of certain significance to avoid the recurrence of similar failure phenomena and ensure the reliability of the devices.