集成电路的ESD防护关键技术分析

Key technical analysis of ESD protection for integrated circuits

与集成电路的发展相对应,芯片采用的工艺也在随之提升,具有比较良好的性能,但是同时先进工艺的使用对芯片产生的静电放电既ESD的承受能力降低了,因此需要提升ESD的防护能力。从而进行ESD防护电路的有效设计,我国ESD的发展应当充分向国际水平看齐。

with the development of integrated circuit, the chip technology is also on the rise, with a relatively good performance, but at the same time the use of advanced technology for chip produced by the electrostatic discharge is the withstanding capability of the ESD is reduced, so you need to improve ESD protection. Therefore, the effective design of ESD protection circuit, the development of ESD in China should be fully integrated with the international level.