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高热稳定性含硅芳炔树脂的制备及其性能 被引量:3

High Thermostability of Silicon-containing Arylacetylene Resin
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摘要 在含硅芳炔中添加乙酰丙酮镍二水合物(Ni(acac)_2·2H_2O)和炔基化合物N,N,N’,N’-四炔丙基-4,4’-二氨基-二苯甲烷(B4)制备了两种高热稳定性PSA树脂体系,考察添加物用量对体系凝胶时间、固化温度和热稳定性的影响。结果显示:当添加0.2wt%的Ni(acac)_2·2H_2O时,凝胶时间21.2min;峰值固化温度214℃;质量损失5%的热分解温度(T_(d5))为651.1℃;再向其中添加3wt%B4后,凝胶时间缩短到8.5min;峰值固化温度提高到221℃;树脂固化物的热稳定性显著提高。 Two silicon-containing arylacetylene(PSA)resin systems with high thermostablity were prepared by adding nickel acetylacetonate dehydrate(Ni(acac)2·2H2O)and N,N,N',N'-tetrapropargyl-p,p'-diaminodi-phenyl methane(B4)in the resins.The influence of additive content on gel-time,curing temperature and thermostability of the PSA was investigated.The results showed that addition of 0.2 wt% Ni(acac)2·2H2O in PSA,the gel-time of 21.2 min,peak curing temperature of 214℃ and the temperature of651.1℃ at 5% mass loss(T(d5))were achieved,while further addition of 3 wt% B4,the gel-time,peak curing temperature and Td5 are 8.5 min,221℃,respectively.Thermostability of cured resin is improved obviously.
作者 阮湘政 邓诗峰 姜欢 RUAN Xiangzheng;DENG Shifeng;JIANG Huan(Key Laboratory of Specially Functional Polymeric Materials and Related Technology(East China University of Science and Technology),Ministry of Education,Shanghai 200237,Chin)
出处 《材料科学与工程学报》 CAS CSCD 北大核心 2018年第4期595-599,604,共6页 Journal of Materials Science and Engineering
关键词 含硅芳炔树脂 乙酰丙酮镍二水合物 炔基化合物 耐高温材料 silicon-containing arylacetylene resin nickel acetylacetonate dehydrate alkynyl compound heat-resistant material
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