摘要
对某大功率电力机车绝缘栅双极型晶体管(IGBT)模块损耗和壳温进行计算,并利用FloEFD仿真软件对IGBT进行散热仿真分析,最后通过试验对实际工况中IGBT壳温进行测试推算。IGBT壳温的计算值、仿真值及测试值接近,证明了IGBT模块冷却设计方法的可行性、准确性,并利用该冷却设计方法对6 500 V/750 A IGBT(FZ750R65KE3)载流能力进行分析,得出该型号IGBT在实际应用中最大载流极限值,对大功率功率单元设计、试验及应用具有指导意义。
The loss and case temperature of the insulated gate bipolar transistor(IGBT) modules used in the high-power electric locomotive are calculated.The FloEFD simulation software is used to simulate and analyze the thermal dissipation of IGBT.Finally, the IGBT case temperature in actual working conditions is tested and calculated.The calculated value, simulation value and test value of the IGBT case temperature are close which proves the feasibility and accuracy of the IGBT module cooling design method.The cooling design method is used to analyze the current carrying capacity of the 6 500 V/750 A IGBT(FZ750R65KE3).The maximum current-carrying limit value of this type of IGBT in practical applications has guiding significance for the design, test and application of high-power power units.
作者
王雷
杨璐
李守蓉
WANG Lei;YANG Lu;LI Shou-rong(CRRC Yongji Electric Co.,Ltd.,Xi'an 710016,China)
出处
《电力电子技术》
CSCD
北大核心
2018年第8期56-58,共3页
Power Electronics
关键词
绝缘栅双极型晶体管
散热
载流
insulated gate bipolar transistor
thermal dissipation
current carrying