IGBT功率模块加速功率循环试验的研究

Study of Accelerated Power Cycling Test of IGBT Power Modules

在此设计了绝缘栅双极型晶体管(IGBT)模块加速功率循环试验电路,通过结温差60 K,80 K和100 K的3次加速功率循环试验,发现铝键合线的翘起、脱离或熔断是加速功率循环试验中IGBT模块失效的主要形式。加速功率循环试验的失效周期数能较好符合经典的寿命预测模型,这说明通过提高结温差来进行加速功率循环试验可大大缩短试验时间,从而提高IGBT模块可靠性的验证效率。

The circuit of accelerated power cycling test for insulated gate bipolar transistor（IGBT） power modules is designed.The accelerated power cycling tests have been run 3 times with the junction temperature swing 60 K, 80 K and 100 K.It is found that the main failure mechanisms of IGBT modules are the lift-off and meltdown of bondedwires.The number of cycles to failure of power cycling tests gets close to the classic model of lifetime prediction,which means that it can shorten the test time greatly by the accelerated power cycling test under higher junction temperature swing,which can improve the reliability verification efficiency of IGBT power modules.