摘要
本文从实际生产需要出发,研究了硫酸浓度、硫酸铜浓度及电流密度等工艺参数对高纵横比PCB通孔均镀能力的影响规律,并通过正交实验确定满足纵横比为8:1的PCB板PTH孔的深镀要求的电镀工艺组合参数。研究表明,PTH孔的均镀能力随着硫酸铜浓度的降低而增加,随着硫酸浓度的升高而增加,随着电流密度的减小而增大;当硫酸浓度为185g/L,硫酸铜浓度为55g/L,当电流密度为1.25A/dm2时,PTH孔的均镀能力达到了90.7%。
Based on actual production need,this paper carried out a study on how technologicalparameters such as sulfuric acid concentration,cupricsulfate concentration and electriccurrentdensity impact on plating homogenization capability of PTH,followed by orthogonal experiment which determined electroplating process combination parameters suitable for 8:1 aspect ratio PCB.It was found that plating homogenization improved when sulfuric acid concentration increased,or when cupricsulfate concentration decreased,or when electriccurrentdensity declined.The PTH plating homogenization achieved 90.7% when sulfuric acid concentration,cupricsulfate concentration and electriccurrentdensity were 185 g/L,55 g/L and 1.25 A/dm2 respectively.
出处
《化工管理》
2018年第25期50-51,共2页
Chemical Engineering Management
关键词
均镀能力
PTH
PCB
纵横比
plating homogenization capability
PTH
PCB
aspect ratio