高纵横比PTH通孔的均镀能力研究

本文从实际生产需要出发,研究了硫酸浓度、硫酸铜浓度及电流密度等工艺参数对高纵横比PCB通孔均镀能力的影响规律,并通过正交实验确定满足纵横比为8:1的PCB板PTH孔的深镀要求的电镀工艺组合参数。研究表明,PTH孔的均镀能力随着硫酸铜浓度的降低而增加,随着硫酸浓度的升高而增加,随着电流密度的减小而增大;当硫酸浓度为185g/L,硫酸铜浓度为55g/L,当电流密度为1.25A/dm2时,PTH孔的均镀能力达到了90.7%。

Based on actual production need,this paper carried out a study on how technologicalparameters such as sulfuric acid concentration,cupricsulfate concentration and electriccurrentdensity impact on plating homogenization capability of PTH,followed by orthogonal experiment which determined electroplating process combination parameters suitable for 8：1 aspect ratio PCB.It was found that plating homogenization improved when sulfuric acid concentration increased,or when cupricsulfate concentration decreased,or when electriccurrentdensity declined.The PTH plating homogenization achieved 90.7% when sulfuric acid concentration,cupricsulfate concentration and electriccurrentdensity were 185 g/L,55 g/L and 1.25 A/dm2 respectively.