陶瓷基板制造工艺的开发及其散热性能研究

利用PVD技术在Al N陶瓷表面制备铜薄膜,并借助电镀工艺将铜薄膜加厚到指定厚度,再利用图形转移及蚀刻工艺完成陶瓷表面的线路制作,并由此开发出一款导热系数极佳的LED封装用散热基板材料;待将上述基板材料应用于LED照明后发现,与普通MCPCB相比,该散热基板能更好地降低LED的结温,使其维持在较低温度范围,进而赋予LED良好的综合性能。

Copper film,which was then thickened by electroplatingprocess to certain thickness,was coated on AlN surface employing PVD technology.With the help of pattern transfer and etching technology,the circuit formed on the AlN surface,thus producing a substrate of high heat dissipation performance for LED lighting.When the abovementioned substrate was used for LED thermal management purpose,it was found that when compared with regular MCPCB,this AlN substrate can greatly decrease LED temperature,keeping it within a relative low temperature range,thus equipping LED with excellent comprehensive performance.