摘要
文章是从实际生产过程中出现的爆板分层等品质问题入手,结合HDI板制作中的常规树脂塞孔工艺与技术出发,采用微切片,X-射线能谱仪等为观察手段。
The paper starts with the quality problems of explosion plate such as delamination in the actual production process,combines the conventional resin plug hole process and technology in the manufacture of HDI plate, and adopts microslicing and Xrayenergy dispersive spectrometer as the observation means. The quality problems caused by resin residue at the orifice and bubblemoisture in the pore during the process of resin ink plug are studied and analyzed, and the corresponding countermeasures and sug-gestions are given.
出处
《科技创新与应用》
2018年第27期93-95,共3页
Technology Innovation and Application
关键词
HDI
树脂塞孔
埋孔
气泡
残留
爆板
HDI
resin plug hole
burying hole
bubble
residue
exploding plate
