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耐压薄壁组件失效分析研究 被引量:1

Failure Analysis on Pressure-Proof Thin-Walled Components
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摘要 通过对耐压薄壁组件失效故障件的分析,介绍了对耐压薄壁组件分析的过程和方法,通过采用X-Ray测试,金相分析,SEM(扫描电镜)&EDS(能谱仪)等分析措施,得出了引起耐压薄壁组件鼓包失效的主要原因,为后续工艺改进提供了参考。 Through analysis of the failure pressure-proof thin-walled components,the process and method of failure analysis for the pressure-proof thin-walled components are introduced in this paper. Through adopting the analysis measures such as the X-Ray test,the metallographic analysis,SEM EDS analysis,etc.,the main reasons for the failure of pressure-proof thin-walled components are obtained,and suggestions for the subsequent process improvement are also provided.
作者 王祥 罗锡 WANG Xiang;LUO Xi(Aeronautical Computing Technique Research Institute of A VIC,Xi'an Shaanxi 710068,China)
出处 《机械研究与应用》 2018年第4期163-165,169,共4页 Mechanical Research & Application
关键词 耐压薄壁组件 失效分析 X-RAY SEM&EDS pressure-proof thin-walled component failure analysis X-Ray test SEM & EDS
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  • 1王文利,梁永生.BGA空洞形成的机理及对焊点可靠性的影响[J].电子工艺技术,2007,28(3):157-159. 被引量:28
  • 2王兆安,黄俊.电力电子技术[M].北京:机械工业出版社.2008.
  • 3Bimal K Bose. Power electronics and motor drives [ M ]. USA, Maryland Heights: Academic Press, 2006.
  • 4钱照明,汪梗生,徐德鸿,等.中国电气工程大典(第2卷)[M].北京:中国电力出版社,2009.
  • 5WU SX, CHIN J, CRIGORICH T, et al. Reliability anal- ysis for fine pitch BGA package [C] //Proceeding of Elec- tronic Component and Technology Conference, 1998:737- 741.
  • 6HONG S,TOSHING T,SUGU V.Comparative studies on solder jointreliability of CTBGA assemblies with various adhesives using the array-basedpackage-shear test[J].Microelectron Reliab,2011,51(9):1898-1902.
  • 7TUNG T N,DNGGY L.Effect of glue on reliability of flip chip BGApackage under thermal cycling[J].Microelectron Reliab,2010,50(7):1000-1006.
  • 8MATTILA T,LI T.On the effects of temperature on the drop reliabilityof electronic component boards[J].Microelectron Reliab,2012,52(1):165-179.
  • 9SEONG-JAE J,KIM J W.Evaluation of drop reliability of Sn-37Pbsolder/Cu joints using a high speed lap-shear test[J].Microelectron Eng,2011,91(10):147-153.
  • 10HAIYU Q,SANKA G,MICHAEL P.No-fault-found and intermittentfailures in electronic products[J].Microelectron Reliab,2008,48(4):663-674.

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