SiC、Si、混合功率模块封装对比评估与失效分析

Comparative Package Evaluation and Failure Mode Analysis of SiC, Si, and Hybrid Power Modules

随着SiC器件在新能源发电、电动汽车等领域的快速发展,对定制化、高可靠SiC功率模块的需求日益迫切。然而,现有SiC功率模块大多沿用Si模块的封装技术,存在寄生电感大等问题,无法适应SiC器件的高速开关能力,难以充分发挥SiC器件的优越性能。该文梳理了功率模块的材料选型准则,以及封装工艺方法,给出了自主封装功率模块的测试流程。针对全Si、混合、全SiC功率模块,基于相同的封装技术和测试方法,对比研究了3种功率模块的动态性能和温敏特性,为不同应用需求下的器件选型提供参考。针对全SiC半桥功率模块,提出了开关损耗的数学模型,并利用实验结果验证了其有效性。此外,结合功率模块的大量故障案例建立了数学模型,分析封装失效的机理,为下一代SiC功率模块的封装集成研究提供了有益的经验和思路。

With expanding consumption of SiC device in fields of renewable energy, electric vehicles, etc., customized and reliable package of SiC power module is urgently needed. However, the package of available SiC power modules is identical to the standard package of Si, which leads to large parasitics and limits the high-frequency capability of SiC device. Thus, it is difficult to fully utilize the superior performance of SiC device. Considering the interaction of package and device performance, material principles and manufacturing procedures of wire-bonding power modules were presented step-by-step in this paper. Besides, flow-chart for fast test of packaged power module was illustrated. By using the same package and test method, comprehensively comparison and analyses of the studied three power modules on dynamic performance was proposed, which is of reference value for the device selection to meet the requirements of different applications. Mathematical models were proposed and experimentally confirmed to investigate the switching losses of SiC half-bridge power module. Additionally, based on a large number of failure samples, mathematical models and analyses were proposed to reveal the failure mechanism of power modules, to toward advanced package integration of nextgeneration SiC power modules.