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全隔离三维介电泳微粒分选芯片的设计及验证

Design and Verification of Fluid-contactless Three-dimensional DEP Chip for Particle Sorting
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摘要 本文设计制备了集成电路(IC)工艺兼容的三维电极阵列的介电泳芯片.芯片中的三维电极位于微流道的侧壁,且与流体完全隔离.芯片具有完全避免电极玷污和大幅降低电极表面强电场对生物样本活性损伤的优势.多物理场耦合分析软件(COMSOL)仿真表明外加100kHz,15Vrms的交变电场时10μm微粒完全分选.实验验证表明:当外加100kHz,20Vrms的交变电场时,9.9μm微粒的分选率为72.6%. IC compatible dielectrophoresis(DEP)chip with 3 Delectrode array is proposed and fabricated in this work.3 Delectrodes are located aside the channel side-wall and are contactless with fluid completely.Therefore,fouling and the damage to bioactivity are protected from high electric field near the electrode surface.10 μm particles can be sorted totally by simulation in COMSOL when 100 kHz,15 Vrmscurrent electric field is applied.In sorting experiments,72.6% of 9.9μm particles are achieved at 20 Vrms with frequency of 100 kHz.
作者 冀秀敏 潘暕 周嘉 JI Xiumin;PAN Jian;ZHOU Jia(ASIC& System State Key Lab,School of Microelectronics,Fudan University,Shanghai 200433,China)
出处 《复旦学报(自然科学版)》 CAS CSCD 北大核心 2018年第4期462-466,共5页 Journal of Fudan University:Natural Science
基金 国家自然科学基金(61674043)
关键词 介电泳芯片 三维电极 流体全隔离 微粒分选 dielectrophoresis(DEP) chip 3D electrodes fluid-contactless particle sorting
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