某芯片封装测试生产线职业病危害调查

Investigation of the occupational hazard in chip package line

目的明确某芯片封装测试生产线产生的职业病危害因素,分析其危害程度及对劳动者健康的影响,评价职业病危害防护措施及其防护效果。方法采用职业卫生现场调查、职业卫生检测、职业健康检查、检查表分析等方法对某芯片封装测试生产线进行综合分析和评价。结果在正常生产、职业病防护设施运行正常的情况下,工作人员接触粉尘、二氧化锡的浓度<10%OELs,接触噪声的8 h等效声级计算结果<80 dB(A),接触激光、紫外辐射的强度<OELs。结论该生产线采取的职业病防护设施设置合理,运行有效。

Objective To confirm the occupational hazards in chip package line,to analyze the harm degree and the influence on the workers＇ health,then evaluate the protective methods and its effects.Methods Field investigation,detection,health examination and checklist were carried out.Results The engineer exposed to dust and stannic oxide concentration was less than 10% OELs,8 h contact noise equivalent continuous A levels was〈 80 dB（A）,exposure to laser and ultraviolet radiation intensity was below OELs and strength of workers were within the scope of occupational exposure limits.Conclusion The preventive methods of chip package line are reasonable and operated effectively.